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datashee t product structure silicon monolithic integrated circuit this product has no designed protec tion against radioactive rays 1/22 www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 14? 001 tsz02201-0e3e0h300150-1-2 11.mar.2013 rev.001 high side switch ics 1ch BD2061AFJ bd2065afj general description single channel high side switch ic for usb port is a high side switch having over current protection used in power supply line of universal serial bus (usb). n-channel power mosfet of low on resistance and low supply current are realized in this ic. and, over current detection circuit, thermal shutdown circuit, under voltage lockout and soft start circuit are built in. features ? low on resistance 80m ? n-ch mosfet switch. ? continuous current load 1.0a ? control input logic ? active-low : BD2061AFJ ? active-high: bd2065afj ? soft start circuit ? over current detection ? thermal shutdown ? under voltage lockout ? open drain error flag output ? reverse-current protection when power switch off ? ttl enable input ? 1.2ms typical rise time applications usb hub in consumer appliances, car accessory, pc, pc peripheral equipment, and so forth key specifications ? input voltage range: 2.7v to 5.5v ? on resistance : 80m ? (typ.) ? over current threshold: 1.1a min., 2.3a max. ? standby current: 0.01 a (typ.) ? operating temperature range: -40 to +85 package w(typ.) d(typ.) h (max.) sop-j8 4.90mm x 6.00mm x 1.65mm typical application circuit lineup over current threshold control input logic package orderable part number min. typ. max. 1.1a 1.5a 2.3a low sop-j8 r eel of 2500 BD2061AFJ ? e2 1.1a 1.5a 2.3a high sop-j8 r eel of 2500 bd2065afj ? e2 sop-j8 out out out in in /oc gnd vbus d- d+ gnd 5v(typ.) c l c in - + en( /en )
2/22 BD2061AFJ bd2065afj datasheet www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 tsz02201-0e3e0h300150-1-2 11.mar.2013 rev.001 0.0 0.2 0.4 0.6 0.8 1.0 -5 0 0 5 0 1 0 0 amb ie nt tem per ature : ta[ ] uvlo hysteresis voltage : vhys[v] block diagram pin configurations pin descriptions BD2061AFJ pin no. symbol i / o pin function 1 gnd i ground. 2, 3 in i power supply input. input terminal to the power switch and power s upply input terminal of the internal circuit. when used, connect each pin outside. 4 /en i enable input. power switch on at low level. high level input > 2.0v, low level input < 0.8v. 5 /oc o error flag output. low at over current, thermal shutdown. open drain output. 6, 7, 8 out o power switch output. when used, connect each pin outside. bd2065afj pin no. symbol i / o pin function 1 gnd i ground. 2, 3 in i power supply input. input terminal to the power switch and power s upply input terminal of the internal circuit. when used, connect each pin outside. 4 en i enable input. power switch on at high level. high level input > 2.0v, low level input < 0.8v 5 /oc o error flag output. low at over current, thermal shutdown. open drain output. 6, 7, 8 out o power switch output. when used, connect each pin outside. BD2061AFJ top view 1 2 3 4 8 7 6 5 gnd in in /oc out out out /en bd2065afj top view 1 2 3 4 8 7 6 5 gnd in in /oc out out out en
3/22 BD2061AFJ bd2065afj datasheet www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 tsz02201-0e3e0h300150-1-2 11.mar.2013 rev.001 absolute maximum ratings parameter symbol ratings unit supply voltage v in -0.3 to 6.0 v enable voltage v en , v /en -0.3 to 6.0 v /oc voltage v /oc -0.3 to 6.0 v /oc current is /oc 10 a out voltage v out -0.3 to 6.0 v storage temperature t stg -55 to 150 power dissipation pd 560 *1 mw *1 in case ta = 25 is exceeded , 4.48mw should be reduced per 1 . recommended operating range parameter symbol ratings unit operating voltage v in 2.7 to 5.5 v operating temperature t opr -40 to 85 continuous output current i lo 0 to 1.0 a electrical characteristics BD2061AFJ (unless otherwise specified, v in = 5.0v, ta = 25 ) parameter symbol limits unit condition min. typ. max. operating current i dd - 90 120 a v /en = 0v, out = open standby current i stb - 0.01 1 a v /en = 5v, out = open /en input voltage v /en 2.0 - - v high input v /en - - 0.8 v low input - - 0.4 v low input 2.7v v in 4.5v /en input current i /en -1.0 0.01 1.0 a v /en = 0v or v /en = 5v /oc output low voltage v /oc - - 0.5 v i /oc = 5ma /oc output leak current il /oc - 0.01 1 a v /oc = 5v /oc delay time td /oc - 2.5 8 ms on resistance r on - 80 100 m ? i out = 1.0a over-current threshold i th 1.1 1.5 2.3 a output current at short i sc 1.1 1.5 1.9 a v in = 5v, v out = 0v, c l = 100 f (rms) output rise time t on1 - 1.2 10 ms r l = 10 ? , c l = open output turn on time t on2 - 1.5 20 ms output fall time t off1 - 1 20 s output turn off time t off2 - 3 40 s uvlo threshold v tuvh 2.1 2.3 2.5 v increasing v in v tuvl 2.0 2.2 2.4 v decreasing v in
4/22 BD2061AFJ bd2065afj datasheet www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 tsz02201-0e3e0h300150-1-2 11.mar.2013 rev.001 electrical characteristics - continued bd2065afj (unless otherwise specified, v in = 5.0v, ta = 25 ) parameter symbol limits unit condition min. typ. max. operating current i dd - 90 120 a v en = 5v, out = open standby current i stb - 0.01 1 a v en = 0v, out = open en input voltage v en 2.0 - - v high input v en - - 0.8 v low input - - 0.4 v low input 2.7v v in 4.5v en input current i en -1.0 0.01 1.0 a v en = 0v or v en = 5v /oc output low voltage v /oc - - 0.5 v i /oc = 5ma /oc output leak current il /oc - 0.01 1 a v /oc = 5v /oc delay time td /oc - 2.5 8 ms on resistance r on - 80 100 m ? i out = 1.0a over-current threshold i th 1.1 1.5 2.3 a output current at short i sc 1.1 1.5 1.9 a v in = 5v, v out = 0v, c l = 100 f (rms) output rise time t on1 - 1.2 10 ms r l = 10 ? , c l = open output turn on time t on2 - 1.5 20 ms output fall time t off1 - 1 20 s output turn off time t off2 - 3 40 s uvlo threshold v tuvh 2.1 2.3 2.5 v increasing v in v tuvl 2.0 2.2 2.4 v decreasing v in
5/22 BD2061AFJ bd2065afj datasheet www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 tsz02201-0e3e0h300150-1-2 11.mar.2013 rev.001 measurement circuit en(/en) out /oc in gnd v in in out out 1uf a v en (v /en ) en(/en) out / oc in gnd v in r l c l in out out 1uf v en (v /en ) a. operating current b. en, /en i nput voltage, output rise, fall time en(/en) out /oc in gnd v in c l in out out 1uf i out v in 10k v en (v /en ) en(/en) out /oc in gnd v in in out out 1uf i /o c v in v en (v /en ) c. on resistance, over current detection d. /oc output low voltage figure 1. measurement circuit timing diagram t on2 t on1 10% 90% 50% 50% 90% 10% t off2 t off1 v out v /en t on2 t on1 10% 90% 50% 50% 90% 10% t off2 t off1 v out v en figure 2. timing diagram (BD2061AFJ) figure 3. timing diagram (bd2065afj)
6/22 BD2061AFJ bd2065afj datasheet www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 tsz02201-0e3e0h300150-1-2 11.mar.2013 rev.001 typical performance curves 0 20 40 60 80 100 120 23456 supply voltage : v in [v] operating current : i dd [ a] v in =5.0v figure 5. operating current en,/en enable figure 4. operating current en,/en enable 0 20 40 60 80 100 120 23456 supply voltage : v in [v] operating current : i dd [ a] ta=25c 0.0 0.2 0.4 0.6 0.8 1.0 23 456 supply voltage : v in [v] standby current : i stb [ a] ta=25c figure 6. standby current en,/en disable figure 7. standby current en,/en disable 0.0 0.2 0.4 0.6 0.8 1.0 -50 0 50 100 ambient temperature : ta[ ] standby current : i stb [ a] v in =5.0v
7/22 BD2061AFJ bd2065afj datasheet www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 tsz02201-0e3e0h300150-1-2 11.mar.2013 rev.001 typical performance curves - continued 0.0 0.5 1.0 1.5 2.0 23 456 supply voltage : v in [v] enable input voltage : v en, v /en [v] 0 low to high high to low ta=25c figure 8. en,/en input voltage 0.0 0.5 1.0 1.5 2.0 - 50 0 50 100 ambient temperature : ta[ ] enable input voltage : v en , v /en [v] v in =5.0v high to low low to high figure 9. en,/en input voltage 0.0 0.1 0.2 0.3 0.4 0.5 23456 supply voltage : v in [v] /oc output low voltage : v /oc [v] ta=25c figure 10. /oc output low voltage 0.0 0.1 0.2 0.3 0.4 0.5 - 50 0 50 100 ambient temperature : ta[ ] /oc output low voltage : v /oc [v] v in =5.0v figure 11. /oc output low voltage
8/22 BD2061AFJ bd2065afj datasheet www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 tsz02201-0e3e0h300150-1-2 11.mar.2013 rev.001 typical performance curves - continued figure 12. on resistance 0 50 100 150 200 23456 supply voltage : v dd [v] on resistance : r on[ m ? ] ta=25c 0.0 1.0 2.0 3.0 4.0 5.0 2 3 4 5 6 supply voltage: v in [v] /oc delay time : ta=25c td /oc [ms] figure 14. /oc output delay time figure 15. /oc output delay time v in =5.0v 0.0 -50 0 50 100 a mbient temperature: ta[ ] 1.0 2.0 3.0 4.0 5.0 /oc delay time : td /oc [ms] figure 13. on resistance 0 50 100 150 200 -50 0 50 100 ambient temperature : ta[ =? ] on resistance : r on [m ? ] v in =5.0v
9/22 BD2061AFJ bd2065afj datasheet www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 tsz02201-0e3e0h300150-1-2 11.mar.2013 rev.001 typical performance curves - continued 0.0 1.0 2.0 3.0 4.0 5.0 -50 0 50 100 ambient temperature : ta[ ] rise time : t on1 [ms] v in =5.0v figure 19. output rise time figure 18. output rise time 0.0 1.0 2.0 3.0 4.0 5.0 23 456 supply voltage : v in [v] rise time : t on1 [ms] ta=25c 0.00 0.50 1.00 1.50 2.00 23456 supply voltage : v in [v] short circuit current : i sc [a] ta=25c figure 16. output current at shortcircuit 0.00 0.50 1.00 1.50 2.00 -50 0 50 100 ambient temperature : ta[ ] short circuit current : i sc [a] v in =5.0v figure 17. output current at shortcircuit
10/22 BD2061AFJ bd2065afj datasheet www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 tsz02201-0e3e0h300150-1-2 11.mar.2013 rev.001 typical performance curves - continued figure 20. output turn on time 0.0 1.0 2.0 3.0 4.0 5.0 23456 supply voltage : v in [v] turn on time : t on2 [ms] ta=25c figure 21. output turn on time 0.0 1.0 2.0 3.0 4.0 5.0 -50 0 50 100 ambient temperature : ta[ ] turn on time : t on2 [ms] v in =5.0v 0.0 1.0 2.0 3.0 4.0 5.0 23456 supply voltage : v in [v] fall time : t off1 [ s] ta=25c figure 22. output fall time 0.0 1.0 2.0 3.0 4.0 5.0 -50 0 50 100 ambient temperature : ta[ ] fall time : t off1 [ s] v in =5.0v figure 23. output fall time
11/22 BD2061AFJ bd2065afj datasheet www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 tsz02201-0e3e0h300150-1-2 11.mar.2013 rev.001 typical performance curves - continued figure 24. output turn off time 0.0 1.0 2.0 3.0 4.0 5.0 23456 supply voltage : v in [v] turn off time : t off2 [ s] ta=25c 0.0 1.0 2.0 3.0 4.0 5.0 - 50 0 50 100 ambient temperature : ta[ ] turn off time : t off2 [ s] v in =5.0v figure 25. output turn off time 2.0 2.1 2.2 2.3 2.4 2.5 - 50 0 50 100 ambient temperature : ta[ ] uvlo threshold voltage : v uvloh , v uvlol [v] v uvloh v uvlol figure 26. uvlo threshold voltage 0.0 0.2 0.4 0.6 0.8 1.0 -50 0 50 100 ambient temperature : ta[ ] uvlo hysteresis voltage : vhys[v] figure 27. uvlo hysteresis voltage
12/22 BD2061AFJ bd2065afj datasheet www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 tsz02201-0e3e0h300150-1-2 11.mar.2013 rev.001 typical wave forms time (20ms/div.) figure 31. over current response ramped load ( BD2061AFJ ) v /oc (5v/div.) v out (5v/div.) i out (0.5a/div.) v in =5v time(1ms/div.) figure 29. output fall characteristic ( BD2061AFJ ) v /en (5v/div.) v /oc ( 5v/div. ) v out (5v/div.) i out (0.5a/div.) v in =5v r l =10 c l =100 f time(1ms/div.) figure 28. output rise characteristic ( BD2061AFJ ) v /en (5v/div ) v /oc (5v/div.) v out (5v/div.) i out (0.5a/div.) v in =5v r l =10 c l =100 f time (0.5ms/div.) figure 30. inrush current response (BD2061AFJ) v en (5v/div.) i out (0.5a/div.) c l =47 f c l =220 f c l =147 f v in =5v r l = 5 v /oc (5v/div.) c l =330 f
13/22 BD2061AFJ bd2065afj datasheet www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 tsz02201-0e3e0h300150-1-2 11.mar.2013 rev.001 typical wave forms - continued time (2ms/div.) figure 32. over current response ramped load ( BD2061AFJ ) v in =5v v /oc ( 5v/div. ) v out ( 5v/div. ) i out (1.0a/div.) time (2ms/div.) figure 33. over current response enable to shortcircuit (BD2061AFJ) v in =5v c l =100 f v /en ( 5v/div. ) v /oc ( 5v/div. ) v out ( 5v/div. ) i out (1.0a/div.) time (2ms/div.) figure 34. over current response enable to shortcircuit (BD2061AFJ) v in =5v c l =100 f v /oc ( 5v/div. ) v out ( 5v/div. ) i out (1.0a/div.) time (0.2s/div.) figure 35. over current response enable to shortcircuit (BD2061AFJ) thermal shutdown v in =5v c l =100 f v /oc ( 5v/div. ) v out ( 5v/div. ) i out (1.0a/div.)
14/22 BD2061AFJ bd2065afj datasheet www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 tsz02201-0e3e0h300150-1-2 11.mar.2013 rev.001 typical wave forms - continued regarding the output rise/fall and over curre nt detection characte ristics of bd2065afj, refer to the characteristic of bd2061af j. time (10ms/div.) figure 37. uvlo response decreasing v in ( BD2061AFJ ) v in ( 5v/div. ) v out ( 5v/div. ) v /oc ( 5v/div. ) i out ( 1.0a/div. ) r l =5 c l =147 f time (10ms/div.) figure 36. uvlo response increasing v in ( BD2061AFJ ) r l =5 c l =147 f v in ( 5v/div. ) v out ( 5v/div. ) i out ( 1.0a/div. ) v /oc ( 5v/div. )
15/22 BD2061AFJ bd2065afj datasheet www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 tsz02201-0e3e0h300150-1-2 11.mar.2013 rev.001 typical application circuit in out regulator out out out in in / oc gnd vbus d - d + gnd usb controller vbus d- d+ gnd 5v(typ.) 10k to 100k ? c l c in - + en ( / en ) application information when excessive current flows due to output short-circuit or so , ringing occurs because of inductance between power source lines to ic, and may cause bad influences on ic operations. in order to avoid this case, connect a bypass capacitor across in terminal and gnd terminal of ic. 1 f or higher is recommended. pull up /oc output by resistance 10k ? to 100k ?. set up value which satisfies the application as c l . this application circuit does not guarantee its operation. when using the circuit with changes to the external circuit c onstants, make sure to leave an adequate margin for external components including ac/dc characteristi cs as well as dispersion of the ic. functional description 1. switch operation in terminal and out terminal are connected to the drain and the source of switch mosfet respectively. and the in terminal is used also as power source input to internal control circuit. when the switch is turned on from en/en control input, in terminal and out terminal are connected by an 80m ? switch. in on status, the switch is bidirectional. therefore, when the potent ial of out terminal is higher than that of in terminal, current flows from out te rminal to in terminal. since a parasitic diode between the drain and the source of swit ch mosfet is not present in the off status, it is possible to prevent current from flowin g reversely from out to in. 2. thermal shutdown circuit (tsd) if over current would continue, the tem perature of the ic would increase dras tically. if the junction temperature were beyond 140 (typ.) in the condition of over current detecti on, thermal shutdown circuit operates and makes power switch turn off and outputs error flag (/oc). then, wh en the junction temperature decreases lower than 120 (typ.), power switch is turned on and error flag (/oc) is cancelled. unless the fact of the increasing chips temperature is removed or the output of power switch is turned off, this operation repeats. the thermal shutdown circuit operates when the switch is on (en,/en signal is active). 3. over current detection (ocd) the over current detection circuit limits current (i sc ) and outputs an error flag (/oc) when current flowing in each switch mosfet exceeds a specified value. ther e are three types of response against ov er current. the over current detection circuit works when the switch is on (en,/en signal is active).
16/22 BD2061AFJ bd2065afj datasheet www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 tsz02201-0e3e0h300150-1-2 11.mar.2013 rev.001 3-1. when the switch is turned on while the output is in short- circuit status, the switch goes into current limit status immediately. 3-2. when the output short- circuits or high-current load is connected while t he switch is on, very large current flows until the over current limit circuit reacts. when the current detection limit circuit wo rks, current limitation is carried out. 3-3. when the output current increases gr adually, current limitation does not work until the output current exceeds the over current detection value. when it exceeds the detection value, current limitation is carried out. 4. under voltage lockout (uvlo) uvlo circuit prevents the switch from turning on until the v in exceeds 2.3v(typ.). if the v in drops below 2.2v(typ.) while the switch turns on, then uvlo shuts off the powe r switch. uvlo has hysteresis of 100mv(typ). under voltage lockout circuit works when the switch is on (en,/en signal is active). 5. error flag (/oc) output error flag output is n-mos open drain output. at detection of over current or thermal shutdown, the output level is low. over current detection has delay filter. this delay filter prevents instantaneous curr ent detection such as inrush current at switch on, hot plug from being informed to outside. v /en v out i out v /oc out p ut shortcircuit thermal shut down delay figure 38. over current detection, thermal shutdown timing (bd2061fj) v en v out i out v /oc out p ut shortcircuit thermal shut down delay figure 39. over current detection, thermal shutdown timing (bd2065afj)
17/22 BD2061AFJ bd2065afj datasheet www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 tsz02201-0e3e0h300150-1-2 11.mar.2013 rev.001 power dissipation (sop-j8) figure 40. power dissipation curve (pd-ta curve) i/o equivalence circuit symbol pin no equivalence circuit en(/en) 4 /oc 5 out 6,7,8 0 100 200 300 400 500 600 0 25 50 75 100 125 150 ambient temperature: ta [ ] power dissipation: pd[mw]
18/22 BD2061AFJ bd2065afj datasheet www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 tsz02201-0e3e0h300150-1-2 11.mar.2013 rev.001 operational notes (1) absolute maximum ratings operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circuit between pins. therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. (2) recommended operating conditions these conditions represent a range within which the expected characteristics of the ic c an be approximately obtained. the electrical characteristics are guaranteed under the conditions of each parameter. (3) reverse connection of power supply connecting the power supply in reverse polarity can da mage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ic?s power supply terminals. (4) power supply lines design the pcb layout pattern to provide low impedance gr ound and supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. furthermore, connect a capacitor to ground at a ll power supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. (5) ground voltage the voltage of the ground pin must be the lo west voltage of all pins of the ic at all operating conditions. ensure that no pins are at a voltage below the ground pin at any time, even during transient condition. (6) short between pins and mounting errors be careful when mounting the ic on printed circuit boards. the ic may be damaged if it is mounted in a wrong orientation or if pins are shorted together. short circuit may be caused by conductive particles caught between the pins. (7) operation under str ong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. (8) testing on application boards when testing the ic on an application board, connecting a capaci tor directly to a low-impedance output pin may subject the ic to stress. always discharge capaci tors completely after each process or step. the ic?s power supply should always be turned off completely before connecting or removing it from the test setup during the in spection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. (9) regarding input pins of the ic this monolithic ic contains p+ isolati on and p substrate layers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of the p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a parasitic diode when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in t he structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. resistor transistor (npn) n n n p + p + p p substrate gnd parasitic element pin a n n p + p + p p substrate gnd parasitic element pin b c b e n gnd pin a pin b other adjacent elements e b c gnd parasitic element parasitic element figure 41. example of monolithic ic structure
19/22 BD2061AFJ bd2065afj datasheet www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 tsz02201-0e3e0h300150-1-2 11.mar.2013 rev.001 (10) gnd wiring pattern when using both small-signal and large-current gnd traces , the two ground traces should be routed separately but connected to a single ground at the refe rence point of the application board to av oid fluctuations in the small-signal ground caused by large currents. also ensure that the gnd tr aces of external components do not cause variations on the gnd voltage. the power supply and ground lines must be as short and thick as possible to reduce line impedance. (11) external capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. (12) thermal shutdown circuit (tsd) the ic incorporates a built-in thermal shutdown circuit, which is designed to turn off the ic when the internal temperature of the ic reaches a specified value. do no t continue to operate the ic after this func tion is activated. do not use the ic in conditions where this function will always be activated. (13) thermal consideration use a thermal design that allows for a sufficient margin by taking into account the permissible power dissipation (pd) in actual operating conditions. consid er pc that does not exceed pd in actual operating conditions (pc pd). package power dissipation : pd (w)=(tjmax ta ) / ja power dissipation : pc (w)=(vcc vo)io+vccib tjmax : maximum junction temperature=150 , ta : peripheral temperature[ ] , ja : thermal resistance of package-ambience[ /w], pd : package power dissipation [w], pc : power dissipation [w], vcc : input voltage, vo : output voltage, io : load, ib : bias current
20/22 BD2061AFJ bd2065afj datasheet www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 tsz02201-0e3e0h300150-1-2 11.mar.2013 rev.001 ordering information b d 2 0 6 1 a f j - e 2 part number package fj: sop-j8 packaging and forming specification e2: embossed tape and reel b d 2 0 6 5 a f j - e 2 part number package fj: sop-j8 packaging and forming specification e2: embossed tape and reel marking diagram part number part number marking BD2061AFJ d061a bd2065afj d065a sop-j8 (top view) part number marking lot number 1pin mark
21/22 BD2061AFJ bd2065afj datasheet www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 tsz02201-0e3e0h300150-1-2 11.mar.2013 rev.001 physical dimension, tape and reel information package name sop-j8 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin
22/22 BD2061AFJ bd2065afj datasheet www.rohm.com ? 2013 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 tsz02201-0e3e0h300150-1-2 11.mar.2013 rev.001 revision history date revision changes 11.mar.2013 001 new release
datasheet datasheet notice - rev.004 ? 2013 rohm co., ltd. all rights reserved. notice general precaution 1) before you use our products, you are requested to care fully read this document and fully understand its contents. rohm shall not be in any way responsible or liable for fa ilure, malfunction or accident arising from the use of any rohm?s products against warning, caution or note contained in this document. 2) all information contained in this document is current as of the issuing date and subjec t to change without any prior notice. before purchasing or using rohm?s products, please confirm the la test information with a rohm sales representative. precaution on using rohm products 1) our products are designed and manufactured for applicat ion in ordinary electronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremel y high reliability (such as medical equipment, transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. 2) rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3) our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4) the products are not subjec t to radiation-proof design. 5) please verify and confirm characteristics of the final or mounted products in using the products. 6) in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse) is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7) de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8) confirm that operation temperature is within t he specified range described in the product specification. 9) rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document.
datasheet datasheet notice - rev.004 ? 2013 rohm co., ltd. all rights reserved. precaution for mounting / circuit board design 1) when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2) in principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification precautions regarding application examples and external circuits 1) if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2) you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1) product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2) even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3) store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4) use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1) all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2) no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document.
datasheet datasheet notice - rev.004 ? 2013 rohm co., ltd. all rights reserved. other precaution 1) the information contained in this document is provi ded on an ?as is? basis and rohm does not warrant that all information contained in this document is accurate and/or error-free. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. 2) this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 3) the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 4) in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 5) the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.

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